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05219
EM1402
3 EMI FILTER/ 2 TVS ARRAY
APPLICATIONS
Cellular Phones Notebooks Personal Digital Assistant (PDA) Ground Positioning System (GPS) SIM Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns 10 BUMP FLIP CHIP
FEATURES
ESD Protection > 25 kilovolts Bidirectional EMI Filtering/TVS Low Pass Filters Low Insertion Loss: -3db Roll-Off @ 77/85 MHz Protects Up to Five(5) Data Lines RoHS Compliant
MECHANICAL CHARACTERISTICS
10 Bump Flip Chip Package Weight 0.73 milligrams (Approximate) Available in Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C Consult Factory for Leaded Device Availability Flammability Rating UL 94V-0 8mm Tape and Reel Per EIA Standard 481
PIN CONFIGURATION
R1 A1 C C
C1
A2
R2 C2 C C
R1 A3 C C
GND C3 A4 C4 C C
R1 = 100 Ohms R2 = 47 Ohms
B1 B2
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EM1402
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
PARAMETER
Operating Temperature Storage Temperature DC Power Per Resistor Typical Resistance @ 20% Typical Resistance @ 20%
SYMBOL
TA TSTG P R1 R2
VALUE
-40 to 85 -55 to 150 100 100 47
UNITS
C C mW OHMS OHMS
ELECTRICAL CHARACTERISTICS PER LINE
PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM LEAKAGE CURRENT
@ 25C Unless Otherwise Specified MINIMUM ATTENUATION CUT-OFF FREQUENCY (50 Ohms I/O) ZERO BIAS TYPICAL CAPACITANCE PER LINE (See Note 1) @2.5V, 1 MHz C pF
TYPICAL FORWARD VOLTAGE
V WM VOLTS
@ 1mA V(BR) VOLTS
@3V ID A
@ 10mA VF VOLTS
@ 800-3000 MHz dB
fc MHz
EM1402
Note 1: 20% tolerance.
5.0
6.0
0.1
0.8
30
77/85
40
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EM1402
GRAPHS
1.100
FIGURE 1 RESISTANCE VS TEMPERATURE (Normalized to Resistance at 25C)
Normalized Resistance
1.060
1.020
0.980
0.940
0.900 -40 -20 0 20 40 Temperature C 60 80 100
FIGURE 2 OVERSHOOT & CLAMPING VOLTAGE
35
5 Volts per Division
25
15
5
-5 ESD Test Pulse: +15 kilovolt, 1/30ns (waveform)
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EM1402
APPLICATION NOTE
The EM1402 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber indenty module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposed during direct contact or during insertion of the SIM card into the card slot. The EMI filter suppresses all high-frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the bidirectional data I/O as shown in Figure 1. For best filter and ESD performance, both ground bumps (B1, B2) of the EM1402 should be directly connected to the ground plane. A small capacitor of about 1F is required next to the VCC pin of the SIM connector in order to improve stability of the SIM card supply rail. CIRCUIT BOARD LAYOUT RECOMMENDATIONS Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are recommended:
VCC supply (5V, 3.3V or 1.8V) VCC SIM Card Connector 100 Ohm RST
Reset
47 Ohm
CLK
Clock
Controller with logic level translator
100 Ohm I/O Data I/O
5V/3V/1.8V
The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. The path length between the TVS device and the protected line should be minimized. All conductive loops including power and ground loops should be minimized. The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.
1F GND GND
Figure 1. Typical Application for SIM Card Interface

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EM1402
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature
VALUE
0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C
REQUIREMENTS
Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating.
RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
TP Ramp-up
Temperature - C
Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat
t 25C to Peak 30-60 seconds
Ramp-up 15 seconds
Solder Time 15-20 seconds
Ramp-down
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EM1402
10 BUMP FLIP CHIP PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
BOTTOM VIEW
PACKAGE DIMENSIONS MILLIMETERS DIM MIN
1.981 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.432 0.330
INCHES MIN
0.0780 0.0506 0.0195 0.0096 0.0169 0.0169 0.0071 0.0071 0.0170 0.0130
A
MAX
2.032 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.559 0.457
MAX
0.0800 0.0541 0.0199 0.0100 0.0173 0.0173 0.0110 0.0110 0.0220 0.0180
G O G
C
D E F
SIDE VIEW
B H
A B C D E F G H I J
I 1
0.30 DIA. 63/67 Sn/Pb Solder Bumps
NOTE: 1. Controlling dimensions in millimeters.
2
3
4
I
J
Outline & Dimensions: Rev 1 - 8/05, 06060
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia. 178mm (7") Tape Width 8mm A0 B0 K0 D E F W P0 P2 P t
1.78 0.05 2.18 0.05 0.51 0.05 1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05 4.00 0.10 0.200.025
P0 t D P2
10 Pitches Cumulative Tolerance on Tape. 0.2
E Top cover tape A0 K0 B0 F W
P
User Direction of Feed
TAPE & REEL ORDERING NOMENCLATURE 1. 2. 3. 4. Surface mount product is taped and reeled in accordance with EIA-481. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e., EM1402-T73-1. Suffix - LF - Lead-Free, i.e., EM1402-LF-T73-1. Suffix - C - Coated, i.e., EM1402-LF-T73C-1.
COPYRIGHT (c) ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
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